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  page ? 1 ? of ? 4 ? www.siliconsupplies.com ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? die size (unsawn) 1080 x 990 42 x 39 m mils minimum bond pad size 116 x 116 4.6 x 4.6 m mils die thickness 350 (20) 13.78 (0.79) m mils top metal composition al 1%si 1.1m back metal composition n/a C bare si low ? power? schottky logic? ? ? 74LS04 hex inverter gates logic ic in bare die form ? high speed C 19ns (typ) propagation delay ? direct drop-in replacement for obsolete components in long term programs. rev 1.0 24/11/17 features: ordering information the following part suffixes apply: ? no suffix - mil-std-883 /2010b visual inspection for high reliability versions of this product please see 54ls04 supply formats: mechanical specification ? default C die in waffle pack (400 per tray capacity) ? sawn wafer on tape C on request ? unsawn wafer C on request ? die thickness <> 350m(14 mils) C on request ? assembled into ceramic package C on request the 74LS04 hex inverter is fabricated using a 2m 40v bipolar process. the devi ce contains six independent inverters with standard push- pull outputs which perform the boolean function y = ? in positive logic. ? description die dimensions in m (mils) 1080 (42) 990 (39) a ll data sheet.com
? d? low ? power? schottky? logic? ? ? 74LS04 rev 1.0 24/11/17 ? ? ? ? ? ? ? ? ? ? ? ? ? ? pad layout and functions logic diagram ? ? ? ? ? ? ? ? ? coordinates (mm) pad function x y 1 1a 0.073 0.268 2 1y 0.132 0.092 3 2a 0.308 0.092 4 2y 0.503 0.092 5 3a 0.685 0.092 6 3y 0.854 0.092 7 gnd 0.880 0.456 8 4y 0.854 0.804 9 4a 0.685 0.804 10 y5 0.503 0.804 11 5a 0.308 0.804 12 6y 0.132 0.804 13 6a 0.073 0.628 14 v cc 0.094 0.450 connect chip back to gnd or float 1080m (42.52 mils) 990m (38.98 mils) 0,0 truth table inputs a output y h l l h h = high level (steady state) l ? = ? low ? level? (steady ? state) ? pad 14 = v cc pad 7 = gnd y = ? ? 13 14 7 8 9 10 11 12 l s 0 4 1 6 2 3 4 5 page ? 2 ? of ? 4 ? www.siliconsupplies.com a ll data sheet.com
page ? 3 ? of ? 4 ? www.siliconsupplies.com ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? low ? power? schottky? logic? ? ? 74LS04 r ev 1.0 24/11/17 parameter symbol min max units supply voltage v cc 4.75 5.25 v high-level input voltage v ih 2 - v low-level input voltage v il - 0.8 v high-level output current i oh - -0.4 ma low-level output current i ol - 8 ma operating temperature range t j 0 +85 c recommended operating conditions absolute maximum ratings 1 parameter symbol value unit dc supply voltage v cc 7.0 v dc input voltage v in 7.0 v storage temperature range t stg -65 to 150 c dc electrical characteristics 2 t j = 0c to 85c unless otherwise specified limits parameter symbol conditions min typ max units minimum high-level input voltage v ih - 2 - - v maximum low-level input voltage v il - - - 0.8 v input clamp diode voltage v ik v cc = min i in = -18ma - -0.65 -1.5 v output voltage high v oh v cc = min, i oh = max v in = v il or v ih per truth table 2.7 3.5 - v output voltage low v ol v cc = v cc min i oh = max v in = v il or v ih per truth table i ol = 8ma - 0.35 0.5 v v cc = max, v in = 2.7v - - 20 a input high current i ih v cc = max, v in = 7.0v - - 0.1 ma input low current i il v cc = max, v in = 0.4v - - -0.4 ma short circuit current 3 i os v cc = max -20 - -100 ma v cc = max ,output high - 1.2 2.4 power supply current (total) i cc v cc = max ,output low - 3.6 6.6 ma 2 . all typical values @ v cc = 5v, t j = 25c. 3. not more than one output should be shorted at a time, nor for more than 1 second. 1. ? operation above the absolute maxi mum rating may cause device fa ilure. operation at the absolute maximum ratings, for extended periods, may reduce device reliability. a ll data sheet.com
page ? 4 ? of ? 4 ? www.siliconsupplies.com ? ? low ? power? schottky? logic? ? ? 74LS04 rev 1.0 24/11/17 ? a c electrical characteristics 4 ? limits parameter symbol conditions min typ max units ? turn-off delay, ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? input to output t plh v cc = 5v, c l = 15pf - 9.0 15 turn-on delay, ns input to output t phl v cc = 5v, c l = 15pf - 10 15 ? 4 . not production tested in die fo rm, characterized by chip desi gn and tested in package. disclaimer: the information given in this document shall in no event be reg arded as a guarantee of conditions or characteristics. with re spect to any examples or hints given herei n, any typical values stated h erein and/or any information r egarding the application of the d evice, silicon supplies ltd hereby disclaims any and all warranties and liabilities of any kind. life support policy : silicon supplies ltd components may be used in life support dev ices or systems only with the express written approval of silicon supplies ltd, if a failure of such componen ts can reasonably be expected to cause the failure of that life support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted i n the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. switchin g waveform test circuit dut c l * ? ? output test point * includes all probe and jig capacitance a ll data sheet.com


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